Singapore, March 13, 2024– With the continuous development of AI data centers, the demand for faster and more efficient data transmission is increasing, and the surge in demand for 800G optical modules directly reflects the escalating demand for AI-driven applications.
The surge in demand for 800G optical modules is closely related to changes in data center network architecture. The traditional three-tier architecture, consisting of an access layer, an aggregation layer, and a core layer, has been the standard for many years.
As the scale of AI technology and east-west traffic continues to expand, the data center network architecture has evolved into a new Spine-Leaf network architecture, which flattens the traditional three-tier topology into a two-tier architecture.
The adoption of 800G optical modules has promoted the emergence of Spine-Leaf network architecture, with high bandwidth utilization, excellent scalability, predictable network latency, and enhanced security.
The following is a typical DGX BasePOD system configuration from Nvidia – DGX A100 HDR.
The NVIDIA 800G switch MQ8700 uses 800G OSFP finned interface to enable the interconnecion for Infiniband 2X HDR and GPU.
The NVIDIA AI server DGX A100 HDR has 800G OSFP-RHS(flat top) ports and 400G OSFP-RHS(flat top) ports.
In order to response the surging demand for 800G optical modules, FIBERSTAMP has launched short-range 800G VR8/SR8/AOC based on VCSEL lasers and 800G DR8/DR8+/DR8++ based on silicon photonics. FIBERSTAMP silicon photonics SMF transceivers and MMF VCSEL transceivers constitute a complete interconnection solution for high-speed AI data centers.
- Silicon Photonics SMF: 800G OSFP Finned top DR8 Dual MPO and 800G OSFP-RHS SR8 Dual MPO, 400G OSFP-RHS DR4 and 400G QSFP112 DR4.
- VECSEL MMF: 800G OSFP Finned top SR8 Dual MPO and 800G OSFP-RHS SR8 Dual MPO, 400G OSFP-RHS SR4 and 400G QSFP112 SR4.
FIBERSTAMP can provide full range of optical products compatible with NVIDIA LINKX, including the DAC and AOC.
With the launch of mass production 800G OSFP MMF and SMF silicon photonics for the data center, FIBERSTAMP is not only able to meet current needs, but also to develop forward-looking immersible liquid cooling 800G and 400G solutions to meet the continued growth in data processing and transmission demands. As technology continues to advance, the close collaboration between AI computing and high-speed optical modules will be a key driver shaping the future information technology infrastructure.
