Singapore, March 25, 2025 – FIBERSTAMP, with a core focus on differentiated optical network product development and design, adheres to its technology philosophy of “Economical, Inevitable, and Differentiated.” Dedicated to driving innovation and breakthroughs in optical communication technology. April 1-3, 2025, FIBERSTAMP will present its cutting-edge technologies at OFC 2025, held at the Moscone Center in San Francisco, USA. Visit us at Booth #5327 and join us to witness the future of optical communication .
Live Demonstration of Two Lightwave Annual Innovation Award-Winning Products
1、100G QSFP28 DWDM1 (O-BAND) Silicon Photonics Module
The Color X 100G QSFP28 DWDM1 O-BAND Silicon Photonics module has honored a high score of 4.5/5 in the Lightwave + BTR Innovation Review.
The module integrates an advanced DSP chip and a monolithic silicon MZ modulator, featuring a 200GHz O-BAND DWDM CWL laser.
Highlight Features:
- Conversion: 4x25G NRZ to 100G PAM4
- TDECQ: < 2.4dB
- Receive Sensitivity: Better than -9dBm
- Power Consumption: Under 3.5W
100G QSFP28 DWDM1 (O-BAND) module delivers 1600G total bandwidth across 16 channels. With external SOA support, it enables cost-effective, non-coherent DWDM 100G DCI transmission over 30KM, setting a new benchmark for efficiency and performance in high-speed networking.
2、800G QSFP-DD CWDM8/LR8 Optical Module
Powered by advanced 8-wavelength multiplexing technology, the 800G QSFP-DD CWDM8/LR8 module delivers high-performance 800GE long-distance transmission over two single-mode fibers—2km for CWDM8 and 10km for LWDM8. Designed with a duplex LC interface, it integrates a TEC-cooled EML laser, PIN detector, and cutting-edge 5nm DSP chip while maintaining ultra-low power consumption below 15W. Engineered for next-generation telecom, data centers, and cloud computing, this module sets a new benchmark for connectivity and transmission efficiency.
Dynamic debut and sustainable innovation of co-packaged optics (CPO)
1、FIBERSTAMP Unveils Innovative CPO/NPO External OSFP Light Source – Seamlessly Compatible with ELSFP Design
- OSFP electrical & MPO12 optical ports, with direct optical output from the module.
- 8-channel PMF output, offering Uncooled HP (17dBm) and Cooled VHP (20dBm) options.
- Commercial-grade durability, operating from -5°C to 70°C.
- Proven reliability, passing Dual 85 and 500-hour testing.
- Liquid cooling compatibility, ensuring seamless integration.
2、Live demonstration of 400G CPO DR4 socket silicon photonic engine, the same package supports 1.6T DR16
The 400G DR4 CPO silicon photonics engine leveraging LPO linear drive technology with a DSP-free design to minimize power consumption and cost while enhancing system interconnect reliability.
- Wavelength Range: 1304.5nm – 1317.5nm
- Output Power: 0-3dBm
- TDECQ: <2.5dB
- Sensitivity: < -5.5dBm
Designed for next-generation high-efficiency data transmission, the same packaging supports 1.6T DR16, paving the way for ultra-high-speed connectivity in AI, cloud computing, and data center networks.
FIBERSTAMP is set to showcase a range of cutting-edge solutions at OFC 2025
800G OSFP 2×FR4 Silicon Photonic Module, designed with dual LC interfaces and integrating a monolithic silicon modulator with 4 CWDM4 light sources. Delivering exceptional performance and efficiency, the module boasts a TDECQ of under 2.1dB, a receive sensitivity of better than -9dBm at 53GBd PAM4, and a maximum power consumption of less than 16W. This makes it the perfect solution for next-generation high-speed networks.
The 100G QSFP28 BiDi ZR4 module, featuring 8-wavelength LAN-WDM bidirectional technology. This advanced module integrates a TEC-cooled 4-wavelength EML laser and a PIN-SOA receiver, enabling 80km single-fiber single-mode transmission with a 30dB optical budget. With built-in 4×25G CDR and a power consumption of less than 6.5W, the module meets telecom-grade stability and reliability standards, offering an ideal solution for long-distance, high-performance optical networks.
FIBERSTAMP showcases its cutting-edge 100G QSFP28 DR1 (EML) Immersion Liquid-Cooled Optical Module. Featuring a hermetically sealed single-wavelength 100G PAM4 EML laser, the module operates with power consumption of less than 4W. Compliant with GR-468 standards, it is designed for both single-phase and dual-phase immersion liquid cooling environments, offering an innovative solution for high-performance and energy-efficient data transmission.
Unique Booth Design, Combining Nostalgia and Knowledge
Step into FIBERSTAMP’s thoughtfully designed booth, where nostalgia meets innovation. With a cozy “POST OFFICE” theme, our booth offers a comfortable, interactive space to explore groundbreaking technologies. Join us at OFC2025 Booth#5327 for an unforgettable journey of discovery and knowledge-sharing. Don’t miss the chance to connect and experience the future of optical communications! FIBERSTAMP warmly welcomes your visit!
