FIBERSTAMP

Navigating the Heat Wave with Immersive Liquid Cooling in Next-Gen Data Centers

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With the widespread application of large-scale AI models in enterprise digitization, there has been a sharp increase in the demand for massive AI computing power. This poses a severe challenge to traditional data centers. The extensive processes of training, inference, and interaction require substantial AI computing power, making the construction of high-density data centers with […]

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Green Living Meets Immersion Data Centers: A Perfect Pairing

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In the ever-evolving landscape of data centers, energy consumption stands out as a significant concern, both from a financial and environmental perspective. The Storage Networking Industry Association emphasizes that energy costs rank among the largest budgetary allocations for data centers, resonating with the top 10 concerns of operators and network operations managers alike. Benefits of

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Data Centers Embrace Immersive Cooling Solutions for AI Overload

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AI applications are known for their voracious appetite for power, especially deep learning models that demand substantial computational resources during training and execution. The hardware requirements for running these applications include advanced components such as GPUs (specialized circuits for accelerating graphics and image rendering) and TPUs (circuits designed to accelerate AI and machine learning workloads).

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Next-Generation DWDM Optical Modules Based on PAM4 Modulation

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The latest report, encompassing the second quarter of 2023, highlighted a 5% year-on-year growth in revenue for optical transport equipment, reaching slightly over $4.0 billion. The consistent growth rate for the optical market over the past three quarters was attributed to higher DWDM long haul and multiservice multiplexer revenue, surpassing initial estimates. Let’s delve further

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AI’s Power Surge Ushers in Liquid Cooling Revolution in Data Centers

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The rising tide of Generative AI, pioneered by OpenAI’s ChatGPT, reshapes the data center landscape. This swift evolution anticipates a whopping $500 Billion Capex by 2027. However, the burgeoning demands of large language models prompt a significant transformation in data center architecture, reminiscent of infrastructures observed in the high-performance computing sector. AI’s Rising Power Demands:

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Critical Role of 12G SDI Optical Modules in Ensuring High-Definition Video Transmission Stability

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12G SDI is a solution designed for 4K ultra-high-definition video transmission.Its primary principle is that 12G SDI can integrate four 3G-SDI signal lines into one, achieving the transmission of 4K audio and video. This integration ensures the quality of transmitting 4K high-definition images and audio while also reducing costs. There’s a significant difference between SDI

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FIBERSTAMP Unveils 400G/800G High-Speed Cables in QSFP-DD/OSFP Form Factors for AI Data Applications

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Singapore, 18th, 2023 – The rise of artificial intelligence in cloud computing and AI-powered factories has driven the demand for high-speed computing and cutting-edge networks. In response, FIBERSTAMP has now introduced an 800G and 400G DAC/ACC/AOC high-speed cable product line that supports AI applications, offering optional QSFP-DD/OSFP form factors to address the needs of data

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Exploring FIBERSTAMP’s Advanced Silicon Photonics for 400G Networks

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In the domain of commercial silicon photonics integration, there exists a clear division into two factions: the III-V family and silicon (Si). The III-V family technology, while mature, is burdened by high costs and incompatibility with CMOS (Integrated Circuit) technology. Conversely, Si silicon devices, leveraging CMOS technology, facilitate passive optoelectronic device integration and single-chip integration,

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Surging Microwave Transmission Revenue Projections Highlight 5G Evolution’s Impact

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A recent forecast by Dell’Oro Group, a reputable source for telecommunications market insights, predicts an upward trajectory in Microwave Transmission equipment revenue. Projections indicate a substantial surge, with expectations soaring to $18 billion over the next five years. This significant uptick represents a remarkable 12 percent increase compared to the previous five-year period. The driving

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Optimizing Thermal Pad Selection: Key Factors for Enhanced Heat Transfer and Reliability

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Thermal pads serve as a crucial link between heating components and heat dissipation surfaces. They are flexible and elastic, enabling coverage of uneven surfaces. These pads facilitate the conduction of heat from individual components or the entire PCB to metal casings or diffusion plates, thereby enhancing the efficiency and lifespan of heat-generating electronic parts. When

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