Linear CPO
Linear CPO is a relatively friendly technology form, eliminates the need for DSPs, enabling higher-speed, lower-power, and more reliable interconnects. It addresses limitations of traditional pluggable optics and emerging LPO technologies, ensuring superior system performance and scalability for next-generation data center networks.
FIBERSTAMP will upgrade the engine to 800G and 1600G
Co-Packaged Optics (CPO) is an advanced optical interconnect technology that integrates optical engines with switch ASICs within the same package. By minimizing electrical link distances, CPO enhances bandwidth density, reduces power consumption, and improves signal integrity.
Based on product 400G DR4 CPO linear silicon photonic engine , FIBERSTAMP plans to upgrade the engine to 800G and 1600G through higher density advanced packaging technology.
Product Description
The 400G DR4 Linear Silicon Photonics Engine with CPO adopts a socket-based package and integrates LPO (Linear Direct Drive) technology. Compared to traditional NPO/CPO architectures, the linear CPO design eliminates the DSP, significantly reducing system-level power consumption and cost.
Transmitter (TX):
- Output power: 0 to 3dBm
- Extinction ratio: 4 to 5dB
- TDECQ: <2.5dB (typically 1-2dB)
- Wavelength range: 1304.5nm - 1317.5nm
- SMSR: ≥30dB
- Receiver (RX):
- OMA sensitivity: <-5.5dBm
The XT-1.6T–DR16/DR16+ CPO Linear Silicon Photonic Engine is a high-performance optical interconnect solution designed for next-generation data centers and high-performance computing (HPC) applications. Leveraging co-packaged optics (CPO) technology, it integrates a 1.6Tbps (Tera-bit per second) optical engine with DR16/DR16+ interfaces, enabling high-speed, low-power, and low-latency optical transmission. By eliminating digital signal processors (DSPs), this linear silicon photonic engine significantly improves energy efficiency, system reliability, and signal integrity while reducing power consumption and thermal challenges.
Product Features
Supports 16-channel 100G PAM4 high-speed signals (53Gbaud/lane)
Silicon photonic modulation chip
Integrated linear driver and TIA
Power consumption less than 16W
1310nm transmission 2KM
High-performance external light source
Electrical port: OIFCEI-112G-XSR
IO interface and mechanical size: OlF-Co-Packaging-3.2T-Module-01.0
Software management interface: OIF-CMIS-05.3
